SkyWater is the first domestic provider of Deca’s M-Series ™ fan-out and Adaptive Patterning ® technologies to support the reshoring of the semiconductor supply chain KISSIMMEE, Fla., January 10, 2024 –( BUSINESS WIRE )– SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, and Deca Technologies (Deca), a leading provider of advanced electronic interconnect technology, today announced the kick-off of a significant new Department of Defense (DOD) effort to expand domestic fan-out wafer level packaging (FOWLP) capabilities for both government and commercial customers. These capabilities will be made possible through the five-year DOD contract recently awarded to Osceola County and SkyWater Florida, which is expected to fund the facilitization, tooling and build-out of the Center for Neovation. With an expected value of $120 million over five years, the award includes options for an additional $70 million, for a total value of up to $190 million. SkyWater is the first domestic licensee of Deca’s M-Series and Adaptive Patterning solutions to support the reshoring of the semiconductor supply chain. The first generation of Deca’s M-Series FOWLP is broadly adopted across multiple device technology nodes in leading smartphones. Deca’s Gen 2 M-Series delivers a powerful new heterogenous integration solution for designers and manufacturers by streamlining the design and assembly processes and providing additional flexibility for multi-chip architectures with sub 20µm pitch. The Gen 2 M-series provides advantages to many markets such as artificial intelligence, high-performance computing and other advanced applications, giving system architects limitless potential through reticle-free maskless digital lithography and the flexibility of a molded interposer layer. Through SkyWater’s collaboration with Deca, embedded devices including active and passive bridge die, integrated passives and a powerful technology roadmap are planned. SkyWater will implement Deca’s Adaptive Patterning, the industry’s only real-time design-during-manufacturing capability, allowing designers to scale to unprecedented device interface density with wider process windows for robust manufacturability.