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Purdue And SEMI Convene Semiconductor Partnership Meeting In Washington, D.C., With Top Indian Government Officials And Industry Leaders

Purdue and SEMI convene semiconductor partnership meeting in Washington, D.C., with top Indian government officials and industry leaders

Purdue and SEMI convene semiconductor partnership meeting in Washington, D.C., with top Indian government officials and industry leaders

Nearly three-dozen representatives from leading U.S. tech companies and Indian government officials took part in the inaugural USA-India Semiconductor Collaborative, hosted by Purdue and semiconductor industry organization SEMI in Washington, D.C. The event coincided with the official state visit of Indian Prime Minster Narendra Modi. (Purdue University photo/Pooja Chaudhary) Inaugural meeting of the U.S.-India Semiconductor Collaborative coincides with state visit to the U.S. by Indian Prime Minister Modi WEST LAFAYETTE, Ind. – Purdue University President Mung Chiang on Friday (June 23) joined top U.S. and Indian government officials and technology industry leaders in Washington, D.C., for the inaugural meeting of the U.S.-India Semiconductor Collaborative, aimed at growing the relationship between Purdue and the South Asian nation. The roundtable event, co-hosted by Purdue and SEMI, a global industry association serving the electronics design and manufacturing supply chain, coincided with the first official state visit to the U.S. of Indian Prime Minster Narendra Modi. Attendees at the semiconductor collaborative’s launch event included U.S. Sen. Todd Young (R-Indiana); Congressman Jim Baird (Indiana-D4); India’s Union Minister for Electronics and IT, the Honorable Ashwini Vaishnaw; Assistant Secretary of State, the Honorable Ramin Toloui; Deputy Director of NIST’s CHIPS R&D Office Eric Lin; SEMI CEO Ajit Manocha; India Semiconductor Mission CEO Amitesh Sinha; and the Director of the Indian Institute of Technology Madras, V. Kamakoti. Senior executives from leading U.S. technology companies including Micron, Intel, IBM, Texas Instruments, MediaTek, GlobalFoundries, Microsoft, Marvell, Synopsys, Cadence, NVIDIA, and others also participated in the meeting and shared their ideas and support for a strong semiconductors partnership between the two countries. “There are opportunities of complementary and coordinated semiconductor partnership between the U.S. and India,” Chiang said. “We’re excited to bring together such a high-level collaboration of academic, government, and industry partners during Prime Minister Modi’s visit in Washington D.C., as Purdue has a special role to play in workforce as in research innovation in CHIPS.” In May, Purdue entered into a landmark international agreement with the government of India to advance workforce development, research and development, and industry partnerships in semiconductors. With that announcement, Purdue was established as a key collaborator with India and the India Semiconductor Mission in skilled workforce development and joint research and innovation in the burgeoning fields of semiconductors and microelectronics. Vijay Raghunathan, professor in the School of Electrical and Computer Engineering and director of semiconductor education at Purdue University, leads the discussion during the inaugural meeting of the USA-India Semiconductor Collaborative in Washington, D.C. (Purdue University photo/Pooja Chaudhary) Download image “I think it sends a very strong message and is a reflection and a recognition of Purdue being not just America’s leading university in semiconductor workforce and R&D but also blazing a trail globally in terms of academic institutions putting together international partnerships,” said Vijay Raghunathan, director of semiconductor education at Purdue and a professor in the Elmore Family School of Electrical and Computer Engineering. Additional information: Purdue partners with IIT Madras to create semiconductor dual-degree program During the meeting in Washington, participants focused on: Reviewing and celebrating ongoing U.S.-India semiconductor collaborations and agreements. Exploring opportunities to strengthen the semiconductor and microelectronics workforce as well as joint research and innovation efforts. Generating a framework for a joint U.S.-India semiconductor roadmap in preparation for the Group of 20 (G-20) Summit in September, which will be held in New Delhi, India. Sen. Young, who co-sponsored the U.S. CHIPS and Science Act of 2022, praised Purdue’s nation-leading efforts in advancing all areas of semiconductor education and R&D – from materials to chip design to advanced packaging, and more. He said, “It is not just about reshoring, but about the U.S. taking the lead, working with partners and allies like India. I am thrilled to see this group of people come together. Count me in as a strong supporter of this initiative.” Hailing the U.S.-India relationship as one of the most defining relationships of this century, Minister Vaishnaw said, “Our cooperation in the area of semiconductors and critical and emerging technologies is vital. The recently signed Purdue-ISM MOU adds value to Purdue, the U.S., and India.” Vaishnaw thanked the U.S. government and partners for their great cooperation and reinforced that the U.S.-India relationship will define the world order in the coming years. The attendees discussed that a goal is to create a landmark international agreement similar to an accord signed on May 21 during the Group of Seven (G-7) summit in Hiroshima, Japan, that established the UPWARDS Network for workforce advancement and research and development in semiconductors. […]

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Daisie Hobson

Daisie Hobson is a Director at the Reshoring Institute and an engineer with many years of experience in manufacturing and project management.

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